Non-Sterile Device Regulations, Human Factors Testing, Combination Products Among New Discussion Topics


(Chicago, IL) – By popular request, the premier educational event for packaging professionals is back with new topics, new speakers, and more networking opportunities. The 3rd Semi-Annual Medical Device Packaging Conference will be held September 24-25, 2015 in San Diego, California.


Nearly a dozen new topics will be on this event’s agenda, such as UDI requirements on non-sterile devices, sustainable packaging, 3D printing, and much more. Some of the packaging industry’s most influential leaders and experts will be on hand to share their insights, lead panels, and participate in networking opportunities, including Jennifer Goff of Stryker Instruments, Stephanie Volk of K2M, and Jonathan Bull of Johnson & Johnson. Conference delegates are encouraged to actively participate in discussions and share ideas during workshops, small group discussions, and during each session question and answer segment.


Unique to this meeting will be the end-user panel, where nurses and clinicians will analyze the packaging and design of products designed by conference attendees and offer their firsthand feedback. Engineers will have the exclusive and valuable opportunity to hear how they can improve upon their design to create a more usable product from Dawn Berthiaume of VA Medical Center, and Suzanne Higginbotham and Jessica Hennessey of Grossmont Plaza Surgery Center.


For more information on the 3rd Semi-Annual Medical Device Packaging Conference, please email or visit You can also follow the conference on Twitter @Q1Productions, #DevPak15.